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Communication Dans Un Congrès Année : 2021

Bonding between high-performance polymer processed by Fused Filament Fabrication and PEEK/carbon fiber laminate

Isciane Caprais
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Emmanuel Duc
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Simon Deseur
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Résumé

Automated fiber placement processes could be combined with additive manufacturing to produce more functionally complex composite structures with more flexibility. The challenge is to add functions or reinforcements to PEEK/carbon composite parts manufactured by automated fiber placement process, with additive manufacturing by fused filament fabrication. This consists of extruding a molten polymer through a nozzle to create a 3D part. Bonding between polymer filaments is a thermally driven phenomenon and determines the integrity and the final mechanical strength of the printed part. 3d-printing high performance polymers is still very challenging because they involve high thermal gradients during the process. The purpose of this work is to find a process window where the bonding strength is maximized between the composite laminate and the first layer of printed polymer, and inside the printed function as well. Experimental measurements of the temperature profiles at the interface between a composite substrate and 3d-printed PEI under different processing conditions were carried out. The interface was observed using microscopic sections. The methodology for studying the impact of printing parameters on the cohesion and adhesion of printed parts with a composite laminate is described. This work provides insights about the influence of processing conditions on the bond formation between high-performance polymer surfaces. It highlights the importance of controlling the thermal history of the materials all along the process.
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hal-03587416 , version 1 (24-02-2022)

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Isciane Caprais, Pierre Joyot, Emmanuel Duc, Simon Deseur. Bonding between high-performance polymer processed by Fused Filament Fabrication and PEEK/carbon fiber laminate. ESAFORM 2021, Apr 2021, Digital Event, Belgium. ⟨10.25518/esaform21.2335⟩. ⟨hal-03587416⟩
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